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IP4365CX11
Integrated (U)SIM card passive filter array and USB full speed ESD protection to IEC 61000-4-2 level 4
Rev. 01 -- 26 March 2010 Product data sheet
1. Product profile
1.1 General description
The IP4365CX11 is a fully integrated smart card interface device according ISO/IEC 7816-3 for the Subscriber Identity Module (SIM) card interface and according ISO/IEC 7816-12 for the Universal Subscriber Identity Module (USIM) Universal Serial Bus (USB) interface. It is designed to provide ElectroMagnetic Interference (EMI) filtering and ElectroStatic Discharge (ESD) protection for the conventional digital interface and also for the USB interface. The 3-channel EMI filter is identical to the filter available as ESD protection and EMI filter IP4366CX8 (which does not contain the additional USB full speed ESD protection). It also provides RC low-pass filtering of undesired Radio Frequency (RF) signals in the 800 MHz to 3 000 MHz frequency band. The IP4365CX11 is designed to provide protection to downstream components from ESD voltages as high as 15 kV contact discharge and > 15 kV air discharge according the IEC 61000-4-2 model, far exceeding standard level 4. The device is fabricated using monolithic silicon technology and integrate three resistors and several high-level ESD-protection diodes in a single Wafer-Level Chip-Scale Package (WLCSP). These features make the IP4365CX11 ideal for use in applications requiring the utmost in miniaturization such as mobile phone handsets, cordless telephones and personal digital devices.
1.2 Features and benefits
Pb-free, RoHS compliant and free of halogen and antimony (Dark Green compliant) 3-channel SIM card interface integrated RC filter array Integrated 100 /100 /47 series channel resistors 2-channel USB full speed compliant ESD protection for USIM 1-channel ESD protection for card supply 10 pF channel capacitance EMI filter compatible with IP4366CX8 Integrated ESD protection withstanding 15 kV contact discharge and > 15 kV air discharge, far exceeding IEC 61000-4-2 level 4 WLCSP with 0.4 mm pitch
1.3 Applications
USIM, SIM and similar smart card interfaces in e.g. cellular and Personal Communication System (PCS) mobile handsets and wireless modems
NXP Semiconductors
IP4365CX11
Integrated SIM card passive filter array and USB ESD protection
2. Pinning information
2.1 Pinning
bump A1 index area
3 A
2
1
B
C
D
008aaa218
transparent top view, solder balls facing down
Fig 1.
Pin configuration
2.2 Pin description
Table 1. Pin A1 A2 A3 B1 B2 B3 C1 C2 C3 D1 D2 D3 Pinning Description internal pin RST or I/O channel ground external pin RST or I/O channel internal pin CLK channel not connected (missing ball) external pin CLK channel internal pin I/O or RST channel ground external pin I/O or RST channel external ESD protection (USB data or supply) external ESD protection (USB data or supply) external ESD protection (USB data or supply)
3. Ordering information
Table 2. Ordering information Package Name IP4365CX11/P WLCSP11 Description wafer level chip-size package; 11 bumps (3 x 4 - B2) Version IP4365CX11/P Type number
IP4365CX11_1
All information provided in this document is subject to legal disclaimers.
(c) NXP B.V. 2010. All rights reserved.
Product data sheet
Rev. 01 -- 26 March 2010
2 of 12
NXP Semiconductors
IP4365CX11
Integrated SIM card passive filter array and USB ESD protection
4. Functional diagram
IEC61000-4-2 level 1 protection pins
R1
IEC61000-4-2 level 4 protection pins
100 R2
A1
A3
B1
47 R3
B3
C1
100
C3 D1 D2 D3
A2, C2
008aaa216
Fig 2.
Schematic diagram
5. Limiting values
Table 3. Limiting values In accordance with the Absolute Maximum Rating System (IEC 60134). Symbol VI VESD Parameter input voltage electrostatic discharge voltage pins A3, B3, C3, D1, D2 and D3 to ground (A2, C2) contact discharge air discharge IEC 61000-4-2 level 4; pins A3, B3, C3, D1, D2 and D3 to ground (A2, C2) contact discharge air discharge IEC 61000-4-2 level 1; pins A1, B1 and C1 to ground (A2, C2) contact discharge air discharge Pch Ptot Tstg Tamb
[1]
[1] [1]
Conditions
Min -0.5
Max +5.5
Unit V
-15 -15
+15 +15
kV kV
-8 -15
+8 +15
kV kV
-2 -2 -55 -35
+2 +2 60 180 260 +85
kV kV mW mW C C
channel power dissipation continuous power; Tamb = 70 C total power dissipation storage temperature 10 s maximum ambient temperature continuous power; Tamb = 70 C
+150 C
Treflow(peak) peak reflow temperature
Device is qualified with 1000 pulses of 15 kV contact discharges each, according to the IEC61000-4-2 model and far exceeds the specified level 4 (8 kV contact discharge).
IP4365CX11_1
All information provided in this document is subject to legal disclaimers.
(c) NXP B.V. 2010. All rights reserved.
Product data sheet
Rev. 01 -- 26 March 2010
3 of 12
NXP Semiconductors
IP4365CX11
Integrated SIM card passive filter array and USB ESD protection
6. Characteristics
Table 4. Electrical characteristics Tamb = 25 C; unless otherwise specified. Symbol Parameter Rs(ch) Cch Conditions R2 channel capacitance channel A1 to A3, channel B1 to B3, channel C1 to C3, pins D1, D2 and D3; Vbias(DC) = 0 V; f = 1 MHz Itest = 1 mA VI = 3 V
[1]
Min 75 35.2 8
Typ 100 47.0 10
Max 125 58.8 12
Unit pF
channel series resistance R1 and R3
VBR ILR
[1]
breakdown voltage reverse leakage current
Guaranteed by design.
6 -
-
10 50
V nA
7. Application information
7.1 Application diagram
A typical application diagram showing IP4365CX11 in a SIM card interface using the standard digital and the USB full speed interface is depicted in Figure 3. The 2 kV ESD compliant pins (A1, B1 and C1) are connected to the baseband interface side while the six 15 kV ESD compliant pins (pins A3, B3, C3, D1, D2 and D3) are connected to the USIM card. Pins D1, D2 and D3 are identical and can be used as required. Also the channel A1 to A3 and the channel C1 to C3 can be exchanged in case this is required for an easier routing.
VSIM
D3 RST A1
R1 100
VCC A3
GND
RST
SPU
CLK
B1
R2 47
B3
CLK
I/O
I/O
C1
R3 100
C3
AUX1 AUX2
USB
D+ D-
D1 D2 SIM/smart card
baseband
A2, C2
008aaa217
Fig 3.
Typical application diagram
IP4365CX11_1
All information provided in this document is subject to legal disclaimers.
(c) NXP B.V. 2010. All rights reserved.
Product data sheet
Rev. 01 -- 26 March 2010
4 of 12
NXP Semiconductors
IP4365CX11
Integrated SIM card passive filter array and USB ESD protection
7.2 Insertion loss
The IP4365CX11 is mainly designed as an EMI/RFI filter for SIM card interfaces. The insertion loss measurement configuration of a typical 50 NetWork Analyzer (NWA) system for evaluation of the IP4365CX11 is shown in Figure 4. The insertion loss in a 50 NWA system for all three resistor equipped channels of IP4365CX11 is depicted in Figure 5. The insertion loss is measured with a test Printed-Circuit Board (PCB) utilizing laser drilled micro-via holes that connect the PCB ground plane to the ground pins.
IN
50
DUT
OUT
50
TEST BOARD
Vgen 001aai755
Fig 4.
Frequency response measurement configuration
0 s21 (dB) -10
008aaa214
(1)
-20
(2)
-30
(3)
-40 10-1
1
10
102
103 f (MHz)
104
(1) Channel B1 to B3. (2) Channel C1 to C3. (3) Channel A1 to A3.
Fig 5.
Measured insertion loss magnitudes
IP4365CX11_1
All information provided in this document is subject to legal disclaimers.
(c) NXP B.V. 2010. All rights reserved.
Product data sheet
Rev. 01 -- 26 March 2010
5 of 12
NXP Semiconductors
IP4365CX11
Integrated SIM card passive filter array and USB ESD protection
7.3 Crosstalk
The crosstalk measurement configuration of a typical 50 NWA system for evaluation of the IP4365CX11 is shown in Figure 6. Six typical examples of crosstalk measurement results of IP4365CX11 are depicted in Figure 7. Unused channels are terminated with 50 to ground.
IN_1
50
DUT
OUT_2 OUT_1
50 50
IN_2
50
TEST BOARD
Vgen 001aai756
Fig 6.
Crosstalk measurement configuration
0 ct (dB) -20
008aaa215
-40
(1) (2) (3)
-60
-80
-100
1
10
102
103 f (MHz)
104
(1) Pin B1 to pin C3. (2) Pin B1 to pin A3. (3) Pin A1 to pin B3.
Fig 7.
Measured crosstalk between different channels
IP4365CX11_1
All information provided in this document is subject to legal disclaimers.
(c) NXP B.V. 2010. All rights reserved.
Product data sheet
Rev. 01 -- 26 March 2010
6 of 12
NXP Semiconductors
IP4365CX11
Integrated SIM card passive filter array and USB ESD protection
8. Package outline
WLCSP11: wafer level chip-size package; 11 bumps (3 x 4 - B2)
D bump A1 index area
A2 E A A1
detail X
e1 e b
D e C e2 B
A 3 European projection
wlcsp11_3x4-b2_po
2
1
X
Fig 8. Table 5. Symbol A A1 A2 b D E e e1 e2
Package outline IP4365CX11 (WLCSP11) Dimensions for Figure 8 Min 0.57 0.18 0.39 0.21 1.11 1.51 Typ 0.61 0.20 0.41 0.26 1.16 1.56 0.4 0.8 1.2 Max 0.65 0.22 0.43 0.31 1.21 1.61 Unit mm mm mm mm mm mm mm mm mm
IP4365CX11_1
All information provided in this document is subject to legal disclaimers.
(c) NXP B.V. 2010. All rights reserved.
Product data sheet
Rev. 01 -- 26 March 2010
7 of 12
NXP Semiconductors
IP4365CX11
Integrated SIM card passive filter array and USB ESD protection
9. Design and assembly recommendations
9.1 PCB design guidelines
For optimum performance it is recommended to use a Non-Solder Mask Defined (NSMD), also known as a copper-defined design, incorporating laser-drilled micro-vias connecting the ground pads to a buried ground-plane layer. This results in the lowest possible ground inductance and provides the best high frequency and ESD performance. For this case, refer to Table 6 for the recommended PCB design parameters.
Table 6. Parameter PCB pad diameter Micro-via diameter Solder mask aperture diameter Copper thickness Copper finish PCB material Recommended PCB design parameters Value or specification 200 m 100 m (0.004 inch) 370 m 20 m to 40 m AuNi FR4
9.2 PCB assembly guidelines for Pb-free soldering
Table 7. Parameter Solder screen aperture diameter Solder screen thickness Solder paste: Pb-free Solder / flux ratio Solder reflow profile Assembly recommendations Value or specification 330 m 100 m (0.004 inch) SnAg (3 % to 4 %) Cu (0.5 % to 0.9 %) 50 / 50 see Figure 9
T (C) Treflow(peak) 250 230 217 cooling rate
pre-heat
t1
t2 t3 t4 t5
t (s)
001aai943
The device is capable of withstanding at least three reflows of this profile.
Fig 9.
IP4365CX11_1
Pb-free solder reflow profile
All information provided in this document is subject to legal disclaimers. (c) NXP B.V. 2010. All rights reserved.
Product data sheet
Rev. 01 -- 26 March 2010
8 of 12
NXP Semiconductors
IP4365CX11
Integrated SIM card passive filter array and USB ESD protection
Table 8. Symbol Treflow(peak) t1 t2 t3 t4 t5 dT/dt
Characteristics Parameter peak reflow temperature time 1 time 2 time 3 time 4 time 5 rate of change of temperature cooling rate pre-heat soak time time during T 250 C time during T 230 C time during T > 217 C Conditions Min 230 60 10 30 2.5 Typ Max 260 180 30 50 150 540 -6 4.0 Unit C s s s s s C/s C/s
10. Abbreviations
Table 9. Acronym DUT EMI ESD FR4 IEC ISO NSMD NWA PCB PCS RF RFI RoHS SIM USB USIM WLCSP Abbreviations Description Device Under Test ElectroMagnetic Interference ElectroStatic Discharge Flame Retard 4 International Electrotechnical Commission International Organization for Standardization Non-Solder Mask Defined NetWork Analyzer Printed-Circuit Board Personal Communication System Radio Frequency Radio Frequency Interference Restriction of Hazardous Substances Subscriber Identity Module Universal Serial Bus Universal Subscriber Identity Module Wafer-Level Chip-Scale Package
11. Revision history
Table 10. Revision history Release date 20100326 Data sheet status Product data sheet Change notice Supersedes Document ID IP4365CX11_1
IP4365CX11_1
All information provided in this document is subject to legal disclaimers.
(c) NXP B.V. 2010. All rights reserved.
Product data sheet
Rev. 01 -- 26 March 2010
9 of 12
NXP Semiconductors
IP4365CX11
Integrated SIM card passive filter array and USB ESD protection
12. Legal information
12.1 Data sheet status
Document status[1][2] Objective [short] data sheet Preliminary [short] data sheet Product [short] data sheet
[1] [2] [3]
Product status[3] Development Qualification Production
Definition This document contains data from the objective specification for product development. This document contains data from the preliminary specification. This document contains the product specification.
Please consult the most recently issued document before initiating or completing a design. The term `short data sheet' is explained in section "Definitions". The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status information is available on the Internet at URL http://www.nxp.com.
12.2 Definitions
Draft -- The document is a draft version only. The content is still under internal review and subject to formal approval, which may result in modifications or additions. NXP Semiconductors does not give any representations or warranties as to the accuracy or completeness of information included herein and shall have no liability for the consequences of use of such information. Short data sheet -- A short data sheet is an extract from a full data sheet with the same product type number(s) and title. A short data sheet is intended for quick reference only and should not be relied upon to contain detailed and full information. For detailed and full information see the relevant full data sheet, which is available on request via the local NXP Semiconductors sales office. In case of any inconsistency or conflict with the short data sheet, the full data sheet shall prevail. Product specification -- The information and data provided in a Product data sheet shall define the specification of the product as agreed between NXP Semiconductors and its customer, unless NXP Semiconductors and customer have explicitly agreed otherwise in writing. In no event however, shall an agreement be valid in which the NXP Semiconductors product is deemed to offer functions and qualities beyond those described in the Product data sheet.
malfunction of an NXP Semiconductors product can reasonably be expected to result in personal injury, death or severe property or environmental damage. NXP Semiconductors accepts no liability for inclusion and/or use of NXP Semiconductors products in such equipment or applications and therefore such inclusion and/or use is at the customer's own risk. Applications -- Applications that are described herein for any of these products are for illustrative purposes only. NXP Semiconductors makes no representation or warranty that such applications will be suitable for the specified use without further testing or modification. NXP Semiconductors does not accept any liability related to any default, damage, costs or problem which is based on a weakness or default in the customer application/use or the application/use of customer's third party customer(s) (hereinafter both referred to as "Application"). It is customer's sole responsibility to check whether the NXP Semiconductors product is suitable and fit for the Application planned. Customer has to do all necessary testing for the Application in order to avoid a default of the Application and the product. NXP Semiconductors does not accept any liability in this respect. Limiting values -- Stress above one or more limiting values (as defined in the Absolute Maximum Ratings System of IEC 60134) will cause permanent damage to the device. Limiting values are stress ratings only and (proper) operation of the device at these or any other conditions above those given in the Recommended operating conditions section (if present) or the Characteristics sections of this document is not warranted. Constant or repeated exposure to limiting values will permanently and irreversibly affect the quality and reliability of the device. Terms and conditions of commercial sale -- NXP Semiconductors products are sold subject to the general terms and conditions of commercial sale, as published at http://www.nxp.com/profile/terms, unless otherwise agreed in a valid written individual agreement. In case an individual agreement is concluded only the terms and conditions of the respective agreement shall apply. NXP Semiconductors hereby expressly objects to applying the customer's general terms and conditions with regard to the purchase of NXP Semiconductors products by customer. No offer to sell or license -- Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights. Export control -- This document as well as the item(s) described herein may be subject to export control regulations. Export might require a prior authorization from national authorities. Non-automotive qualified products -- Unless this data sheet expressly states that this specific NXP Semiconductors product is automotive qualified, the product is not suitable for automotive use. It is neither qualified nor tested in accordance with automotive testing or application requirements. NXP Semiconductors accepts no liability for inclusion and/or use of non-automotive qualified products in automotive equipment or applications. In the event that customer uses the product for design-in and use in automotive applications to automotive specifications and standards, customer (a) shall use the product without NXP Semiconductors' warranty of the
(c) NXP B.V. 2010. All rights reserved.
12.3 Disclaimers
Limited warranty and liability -- Information in this document is believed to be accurate and reliable. However, NXP Semiconductors does not give any representations or warranties, expressed or implied, as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. In no event shall NXP Semiconductors be liable for any indirect, incidental, punitive, special or consequential damages (including - without limitation - lost profits, lost savings, business interruption, costs related to the removal or replacement of any products or rework charges) whether or not such damages are based on tort (including negligence), warranty, breach of contract or any other legal theory. Notwithstanding any damages that customer might incur for any reason whatsoever, NXP Semiconductors' aggregate and cumulative liability towards customer for the products described herein shall be limited in accordance with the Terms and conditions of commercial sale of NXP Semiconductors. Right to make changes -- NXP Semiconductors reserves the right to make changes to information published in this document, including without limitation specifications and product descriptions, at any time and without notice. This document supersedes and replaces all information supplied prior to the publication hereof. Suitability for use -- NXP Semiconductors products are not designed, authorized or warranted to be suitable for use in medical, military, aircraft, space or life support equipment, nor in applications where failure or
IP4365CX11_1
All information provided in this document is subject to legal disclaimers.
Product data sheet
Rev. 01 -- 26 March 2010
10 of 12
NXP Semiconductors
IP4365CX11
Integrated SIM card passive filter array and USB ESD protection
product for such automotive applications, use and specifications, and (b) whenever customer uses the product for automotive applications beyond NXP Semiconductors' specifications such use shall be solely at customer's own risk, and (c) customer fully indemnifies NXP Semiconductors for any liability, damages or failed product claims resulting from customer design and use of the product for automotive applications beyond NXP Semiconductors' standard warranty and NXP Semiconductors' product specifications.
12.4 Trademarks
Notice: All referenced brands, product names, service names and trademarks are the property of their respective owners.
13. Contact information
For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: salesaddresses@nxp.com
IP4365CX11_1
All information provided in this document is subject to legal disclaimers.
(c) NXP B.V. 2010. All rights reserved.
Product data sheet
Rev. 01 -- 26 March 2010
11 of 12
NXP Semiconductors
IP4365CX11
Integrated SIM card passive filter array and USB ESD protection
14. Contents
1 1.1 1.2 1.3 2 2.1 2.2 3 4 5 6 7 7.1 7.2 7.3 8 9 9.1 9.2 10 11 12 12.1 12.2 12.3 12.4 13 14 Product profile . . . . . . . . . . . . . . . . . . . . . . . . . . 1 General description . . . . . . . . . . . . . . . . . . . . . 1 Features and benefits . . . . . . . . . . . . . . . . . . . . 1 Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 Pinning information . . . . . . . . . . . . . . . . . . . . . . 2 Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2 Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 2 Ordering information . . . . . . . . . . . . . . . . . . . . . 2 Functional diagram . . . . . . . . . . . . . . . . . . . . . . 3 Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 3 Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . 4 Application information. . . . . . . . . . . . . . . . . . . 4 Application diagram . . . . . . . . . . . . . . . . . . . . . 4 Insertion loss . . . . . . . . . . . . . . . . . . . . . . . . . . 5 Crosstalk. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6 Package outline . . . . . . . . . . . . . . . . . . . . . . . . . 7 Design and assembly recommendations . . . . 8 PCB design guidelines . . . . . . . . . . . . . . . . . . . 8 PCB assembly guidelines for Pb-free soldering 8 Abbreviations . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 Revision history . . . . . . . . . . . . . . . . . . . . . . . . . 9 Legal information. . . . . . . . . . . . . . . . . . . . . . . 10 Data sheet status . . . . . . . . . . . . . . . . . . . . . . 10 Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . 11 Contact information. . . . . . . . . . . . . . . . . . . . . 11 Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
Please be aware that important notices concerning this document and the product(s) described herein, have been included in section `Legal information'.
(c) NXP B.V. 2010.
All rights reserved.
For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: salesaddresses@nxp.com Date of release: 26 March 2010 Document identifier: IP4365CX11_1

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